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  Datasheet File OCR Text:
 SHINDENGEN
General Purpose Rectifiers
SMT Bridges
S1ZB20
200V 0.8A
FEATURES *oe Small SMT package *oe High reliability with superior *oe moisture resistance *oe Applicable to Automatic Insertion APPLICATION
*oe Switching
OUTLINE DIMENSIONS
Case : 1Z 1Z Case : Unit : mm
power supply *oe Home Appliances, Office Equipment *oe Telecommunication, Factory Automation
RATINGS
*oeAbsolute Maximum Ratings (If not specified Tl=25*Z) Item Symbol Conditions Ratings Unit Storage Temperature Tstg -40*150 *Z Operating Junction Temperature Tj 150 *Z Maximum Reverse Voltage VRM 200 V IO Average Rectified Forward Current50Hz sine wave, R-load On alumina substrate Ta=25*Z 0.8 A 50Hz sine wave, R-load On glass-epoxy substrate 0.5 Ta=25*Z Peak Surge Forward Current IFSM 50Hz sine wave, Non-repetitive 1 cycle peak value, Tj=25*Z A 30 Current Squared Time I2 t 1ms*...t*10ms Tj=25*Z 4.5 A2s *oeElectrical Characteristics (If not specified Tl=25*Z) Item Symbol Conditions Ratings Unit Forward Voltage VF I =0.4A, Pulse measurement, Rating of per diodeMax.1.05 V F R RM Reverse Current IR V =V , Pulse measurement, Rating of per diode Max.10 EA AEjl junction to lead Max.20 Thermal Resistance AEja junction to ambient On alumina substrate Max.76 *Z/W junction to ambient On glass-epoxy substrate Max.134
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
S1ZBx
10
Forward Voltage
Forward Current IF [A]
1
Tl=150C [TYP]
Tl=25C [TYP]
0.1
Pulse measurement per diode
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
Forward Voltage VF [V]
S1ZBx
3
Forward Power Dissipation
Forward Power Dissipation PF [W]
2.5 SIN 2
1.5
1
0.5
0
0
0.2
0.4
0.6
0.8
1
1.2
Average Rectified Forward Current IO [A]
Tj = 150C Sine wave
S1ZBx
0.7
Derating Curve
Average Rectified Forward Current IO [A]
0.6 SIN 0.5
PCB Glass-epoxy substrate Soldering land 6 x 2mm Conductor layer 35m
0.4
0.3
0.2
0.1
0
0
20
40
60
80
100
120
140
160
Ambient Temperature Ta [C]
Sine wave R-load Free in air
S1ZBx
0.7
Derating Curve
Average Rectified Forward Current IO [A]
0.6 SIN 0.5
0.4
0.3
0.2
0.1
0
0
20
40
60
80
100
120
140
160
Ambient Temperature Ta [C]
Sine wave R-load Free in air
Soldering land Conductor layer Substrate thickness
Glass-epoxy 1mm 35m
Alumina 1mm 20m 0.64mm
S1ZBx
40
Peak Surge Forward Capability
IFSM
35
10ms 10ms
1 cycle
Peak Surge Forward Current IFSM [A]
30
non-repetitive, sine wave, Tj=25C before surge current is applied
25
20
15
10
5
0
1
2
5
10
20
50
100
Number of Cycles [cycles]


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